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February 2005 Version 1. Order Number A29286-

Front Panel I/O Connectivity

Design Guide

Revision History

Revision Revision History Date 1.3 Updated:

• Lead free part numbers where available Added:
• 1394B header mechanical information and pin out assignment
• Front Panel 1394b header definition.
• Color coding 1394A vs. 1394B headers.
• 1394 cable spec for inclusion in 1394 documentation
• Warning regarding need to change the configuration of a 1394B port when a 1394A dongle is plugged in.
• USB shrouded header with key slot
• 1394 shrouded header with key slot
• Header port to cable I/O chart

February 2005

1.2 Updated:

• Front Panel Audio Cable Cross Section drawing
• Audio Cable Wiring Diagram drawing
• URL links under Design Specifications
• USB Connectors section under Front Panel High Speed Serial Bus Added:
• Front Panel Audio and Intel®^ High Definition Audio (Intel®^ HD Audio); text, tables, and drawings
• Duel and Single Port USB cable information, text, tables, and drawings

July 2004

1.1 Updated:

• Audio Cable Cross-Section drawing
• Audio Cable Wiring diagram
• Front panel connector pinout
• Front panel, USB, and rear panel connectors pin descriptions
• Specification references Added:
• Audio pull-up resistor information
• Fuse and filtering notes
• Manufacturer's part numbers
• "Top/bottom/ outside view" to graphics

December 2002

1.0 Initial release. October 2000

v

Preface

This guide describes connection and mechanical recommendations for all main boards having internal connectors requiring external connection. Recommendations include (among others): front panel I/O header pin-out definition, chassis I/O aperture size, I/O interface board dimensions and motherboard to front panel board I/O cable shielding and size. Front panel I/O legacy connectors, internal legacy and legacy-free connectors are also addressed. Specific to front panel I/O the goal is for any particular setup of main board, interface board, interface cable and chassis that meets the pinout and physical dimension recommendations of this design guide will be physically compatible with another setup that also meets the requirements of this design guide. Environmental and electrical compatibility testing should be conducted for all designs arising from use of this design guide.

Intended Audience

The guide is intended to provide detailed, technical information to vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description 1 Supporting Documentation 2 Front Panel Legacy I/O 3 Front Panel High Speed Serial Bus 4 Cabling Design Guidelines 5 Interface Board Design Guidelines 6 Chassis and I/O Shield Guidelines 7 Internal Legacy Connectors (Reference) 8 Internal Legacy-Free Connectors (Reference)

vii

Contents

Front Panel I/O Connectivity Design Guide

viii

Front Panel I/O Connectivity Design Guide x

• 1.1 Online Support 1 Supporting Documentation
• 1.2 Design Specifications...................................................................................................
• 1.3 Recommended Roles of Suppliers...............................................................................
  • 1.3.1 Chassis Supplier............................................................................................
  • 1.3.2 Motherboard Manufacturer or Chassis Supplier............................................
  • 1.3.3 Third-Party Interface Board Supplier
• 2.1 Introduction 2 Front Panel Legacy I/O
• 2.2 Switch/LED and IR Connectors....................................................................................
  • 2.2.1 Usage Models................................................................................................
  • 2.2.2 Switch/LED Connector Features
  • 2.2.3 IR Connector Features
  • 2.2.4 Header Design...............................................................................................
  • 2.2.5 Pin Assignments............................................................................................
• 2.3 Front Panel Audio
  • 2.3.1 Usage Model
  • 2.3.2 Features
  • 2.3.3 Audio Design Considerations
  • 2.3.4 AC’97 Audio...................................................................................................
  • 2.3.5 Intel ®High Definition Audio
• 3.1 Introduction 3 Front Panel High Speed Serial Bus
• 3.2 USB Connectors
  • 3.2.1 Usage Model
  • 3.2.2 Features
  • 3.2.3 Dual Port USB Header
  • 3.2.4 Dual Port USB Header Pin Assignments.......................................................
  • 3.2.5 Single Port USB Header................................................................................
  • 3.2.6 Single Port USB Header Pin Assignments
  • 3.2.7 Dual USB Header Usage...............................................................................
  • 3.2.8 Electrical Considerations
• 3.3 IEEE-1394 Connector
  • 3.3.1 Usage Model
  • 3.3.2 Features
  • 3.3.3 1394 Header Design......................................................................................
  • 3.3.4 Pin Assignments............................................................................................
• 4.1 Introduction 4 Cabling Design Guidelines
• 4.2 Switch/LED Cable
• 4.3 Front Panel Audio Cable
  • 4.3.1 Introduction....................................................................................................
  • 4.3.2 Cable Drawings
• 4.4 USB Cabling (Motherboard to I/O Interface Board)
  • 4.4.1 Introduction....................................................................................................
  • 4.4.2 Cable Drawings
• 4.5 IEEE1394 Cabling (Motherboard to I/O Interface Board).............................................
  • 4.5.1 Introduction....................................................................................................
  • 4.5.2 Cable Drawings
• 5.1 Introduction 5 Interface Board Design Guidelines
• 5.2 Front Panel I/O Interface Board Dimensions
• 6.1 Introduction 6 Chassis and I/O Shield Guidelines
• 6.2 Front Panel I/O Board Placement
• 6.3 Front Panel I/O Reference Designs
  • 6.3.1 I/O Shield Reference Design
  • 6.3.2 Housing Reference Design............................................................................
  • 6.3.3 Housing and Shield Assembly Reference Design
  • 6.3.4 Supporting Structure Reference Design........................................................
  • 6.3.5 Supporting Structure and Shield Reference Design......................................
• 7.1 Introduction 7 Internal Legacy Connectors (Reference)
• 7.2 Serial-WHQL Debug Connector...................................................................................
  • 7.2.1 Header Design...............................................................................................
  • 7.2.2 Pin Assignments............................................................................................
• 7.3 Parallel Port Connectors
  • 7.3.1 Rear Panel Connector
  • 7.3.2 Stake-Pin Connector
• 8.1 Introduction 8 Internal Legacy-Free Connectors (Reference)
• 8.2 LPC (Low Pin Count) Debug Connector
  • 8.2.1 Usage Model
  • 8.2.2 Features
  • 8.2.3 Header Design...............................................................................................
  • 8.2.4 Pin Assignments............................................................................................
  • 8.2.5 LPC Debug Connector Pin Assignments.......................................................
• 1. Front Panel Switch/LED and IR Headers (Top View) Figures
• 2. AC’97 Front Panel Dongle Schematic
• 3. Front Panel Audio Header (Top View)
• 4. Intel ® HD Audio - Analog Front Panel Header........................................................................
• 5. Intel ® HD Audio Front Panel Analog Header Motherboard Schematic...................................
• 6. Intel ® HD Audio Front Panel Dongle Implementation
• 7. Dual Port USB Header (Top View)
• 8. Front Panel Single Port USB Header (Top View)
• 9. Front Panel IEEE-1394A/B Connector (Top View)
• 10. Switch/LED Cable
• 11. Front Panel Audio Cable Dimensions
• 12. Front Panel Audio Cable Cross-Section
• 13. Audio Cable Wiring Diagram................................................................................................
• 14. Dual Port USB Cable Cross Section....................................................................................
• 15. Dual Port USB Cable Wiring Diagram
• 16. Dual USB Cable Diagram
• 17. Single Port USB Cable Cross Section
• 18. Single Port USB Cable Wiring Diagram...............................................................................
• 19. Dual USB Cable Diagram
• 20. Single Port IEEE 1394A/B Cable Cross Section..................................................................
• 21. IEEE 1394A/B Cable Wiring Diagram..................................................................................
• 22. IEEE 1394A/B Cable Diagram
• 23. Front Panel I/O Aperture and Interface Board Placement Recommendations
• 24. Front Panel I/O Interface Board Placement Recommendations
• 25. Front Panel I/O Board Dimensions (Top and Front Views)..................................................
• 26. Front Panel I/O Board Dimensions (Bottom View)...............................................................
• 27. Front Panel I/O Aperture and Interface Board Placement Recommendations
• 28. Front Panel I/O Interface Board Placement Recommendations
• 29. Front Panel I/O Shield Reference Design............................................................................
• 30. I/O Shield Reference Design
• 31. Front Panel I/O Housing Reference Design.........................................................................
• 32. Front Panel I/O Housing and Shield Assembly Reference Design
• 33. Front Panel I/O Interface Board Support Structure Reference Design
• 34. Front Panel I/O Board Support Structure Reference Design
• 35. Serial-WHQL Debug Connector (Top View)
• 36. Motherboard Footprint for the Parallel Port Rear Panel Connector (Bottom View)..............
• 37. Parallel Port Rear Panel Connector (Outside View)
• 38. LPC Debug Connector Dimensions
• 39. LPC Debug Connector Hole Layout.....................................................................................
• 40. LPC Debug Connector Keep-Out Zone
• 41. LPC Debug Connector Pin Numbering
• 1. Specifications and Design Guidelines Tables
• 2. States for a Single-Color Power LED
• 3. States for a Dual-Color Power LED
• 4. IR Front Panel Electrical Connection...................................................................................
• 5. Switch/LED Front Panel Electrical Connection....................................................................
• 6. AC’97 Front Panel Audio Header Signal Names
• 7. Intel ® HD Audio Front Panel Analog Header Signal Names
• 8. Dual Port USB Header Pin Assignments.............................................................................
• 9. Single Port USB Header Pin Assignments
• 10. Front Panel IEEE-1394A Connector....................................................................................
• 11. Front Panel IEEE-1394B Connector....................................................................................
• 12. Header Port to Cable I/O Board Configuration Chart
• 13. Front Panel Audio Cable and Connector Pin Assignments
• 14. Audio Cable Construction Recommendations
• 15. Additional Audio Cable Recommendations
• 16. Dual Port USB Cable and Connector Pin Assignments.......................................................
• 17. Dual Port USB Cable Material List.......................................................................................
• 18. Single Port USB Cable and Connector Pin Assignments
• 19. Single Port USB Cable Material List
• 20. USB Cable Recommendations
• 21. IEEE 1394A Cable and Connector Pin Assignments
• 22. IEEE 1394B Cable and Connector Pin Assignments
• 23. Header Port to Cable I/O Board Configuration Chart
• 24. IEEE 1394A/B Material List
• 25. Serial-WHQL Debug Connector
• 26. Parallel Port Rear Panel Connector (Centronics Standard)
• 27. Parallel Port Stake-Pin Connector
• 28. LPC Debug Connector Features
• 29. LPC Debug Connector Pin Assignment...............................................................................

11

1 Supporting Documentation

What This Chapter Contains

1.1 Online Support ............................................................................................................. 11 1.2 Design Specifications................................................................................................... 12 1.3 Recommended Roles of Suppliers............................................................................... 14

1.1 Online Support

Find information about Intel®^ motherboards under “Product” at these World Wide Web sites: http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop

Find processor data sheets at this World Wide Web site: http://appzone.intel.com/literature/index.asp

Find information about the ICH addressing at this World Wide Web site: http://developer.intel.com/design/chipsets/datashts/

Find information about USB testing and compatibility at this World Wide Web site: http://www.usb.org

Find information about USB 2.0 that can be downloaded from the USB- web site: http://www.usb.org/developers/usb

Find a white paper describing the signal quality compliance testing procedures for USB low speed and full speed signaling at: http://www.usb.org/developers/compliance/

Find a design guide for integrating a discrete USB 2.0 host controller onto a four-layer desktop motherboard at: http://developer.intel.com/technology/usb/techlit.htm

Find information about IEEE 1394 that can be downloaded from the IEEE web site: http://www.IEEE.org

13

Table 1. Specifications and Design Guidelines (continued)

Reference Name

Specification Title

Version, Revision Date, and Ownership

The information is available from… UHCI Universal Host Controller Interface Design Guide

Version 1.1, March 1996, Intel Corporation.

http://developer.intel.com/ design/USB/UHCI11D.htm

Universal Serial Bus Specification

Version 1.1, September 23, 1998, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, and NEC. (This specification is superseded by the USB 2.0 Specification and should only be used for historical reference.)

Search for the information at either: http://www.usb.org/ or http://www.usb.org/ developers/docs/

Universal Serial Bus Specification

Version 2.0, April 27, 2000 Compaq Computer Corporation, Hewlett-Packard* Co., Intel Corporation, Lucent* Technologies, Inc, Microsoft Corporation, NEC, and Philips.

http://www.usb.org/ developers/docs/

USB

USB 2.0 Platform Design Guideline

Version 1.0 See below**

WfM Wired for Management Baseline

Version 2.0, December 18, 1998, Intel Corporation

http://www.intel.com/labs/ manage/wfm/wfmspecs.htm

** The USB 2.0 Platform Design Guideline, Rev. 1.0 provides guidelines for integrating a discrete USB 2.0 host controller onto a four-layer desktop motherboard. The material covered can be separated into three main categories:

• Board design guidelines
• EMI/ESD guidelines
• Front panel USB guidelines The USB 2.0 Platform Design Guideline also covers some background information on the routing experiments and testing performed to validate the feasibility of 480 Mbits per second on an actual motherboard. Finally, it contains a design checklist that lists each design recommendation described in the document. USB 1.1 drop/droop testing may be available at: http://www.usb.org/developers/ USB 1.1 signal quality testing may be available at: http://www.usb.org/developers/

Front Panel I/O Connectivity Design Guide

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1.3 Recommended Roles of Suppliers

1.3.1 Chassis Supplier

The chassis supplier should provide the front panel I/O board support structure and attachment screws. Screws may not be necessary if a support structure implementing an I/O board with the “snap-in” feature is used. A filler panel (or panels) to close-up the opening in the chassis and bezel should also be provided in the event that the front panel I/O board feature is not used by a particular customer.

1.3.2 Motherboard Manufacturer or Chassis Supplier

The motherboard manufacturer or chassis supplier should provide the interface board and the following items:

• Interface cable(s)
• Front panel I/O shield
• Appropriate decorative plastic sticker to cover any unused ports in the I/O shield The motherboard manufacturer or chassis supplier should test the interface board and cable(s) with the motherboard to ensure compatibility.

1.3.3 Third-Party Interface Board Supplier

A generic interface board provided by a third-party vendor may not function correctly with a particular motherboard. If a third-party supplier’s interface board is to be used, the motherboard manufacturer should conduct testing to ensure the motherboard’s compatibility.

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2.2.2 Switch/LED Connector Features

2.2.2.1 Hard Drive Activity LED

Connecting pins 1 and 3 to a front panel mounted LED provides visual indication that data is being read from or written to the hard drive. For the LED to function properly, an IDE drive should be connected to the onboard IDE interface. The LED will also show activity for devices connected to the SCSI (hard drive activity LED) connector.

2.2.2.2 Power / Sleep / Message Waiting LED

Connecting pins 2 and 4 to a single- or dual-color, front panel mounted LED provides power on/off, sleep, and message waiting indication. Table 2 shows the possible states for a single-color LED. Table 3 shows the possible states for a dual-color LED.

2.2.2.3 Reset Switch

Supporting the reset function requires connecting pins 5 and 7 to a momentary-contact switch that is normally open. When the switch is closed, the board resets and runs POST.

2.2.2.4 Power Switch

Supporting the power on/off function requires connecting pins 6 and 8 to a momentary-contact switch that is normally open. The switch should maintain contact for at least 50 ms to signal the power supply to switch on or off. The time requirement is due to internal debounce circuitry. After receiving a power on/off signal, at least two seconds elapses before the power supply recognizes another on/off signal.

Table 2. States for a Single-Color Power LED

LED State Description ACPI State Off Sleeping or power off (not running) S1, S3, S Steady Green Running S Blinking Green Running/message waiting S

Table 3. States for a Dual-Color Power LED

LED State Description ACPI State Off Power off S Steady Green Running S Blinking Green Running/message waiting S Steady Yellow Sleeping S1, S Blinking Yellow Sleeping/message waiting S1, S

 NOTE

To use the message waiting function, ACPI should be enabled in the operating system and a message-capturing application should be invoked.

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2.2.3 IR Connector Features

2.2.3.1 Infrared Port

Serial Port B can be configured to support an IrDA module connected to pins 1, 2, 3, 5, and 6 of the 2x3-pin header connector.

2.2.4 Header Design

OM

2

1 2

1 10

9 6

5

B C

E D

A (^5 1 )

6 2

1

10 2

Header Description Item Pins Description

Manufacturer's Part Number Note IR Front Panel Header (see Table 4)

A 1, 2, 3, 5, and 6

Infrared port Wieson Electronic 2100C888- B 5 and 7 Reset switch C 1 and 3 Hard drive activity LED D 2 and 4 Power / Sleep / Message waiting LED

Switch/LED Front Panel Header (see Table 5)

E 6 and 8 Power switch

Wieson Electronic 2100C888-

Note: Or equivalent.

Figure 1. Front Panel Switch/LED and IR Headers (Top View)

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2.3 Front Panel Audio

2.3.1 Usage Model

The design options described below support standard front panel microphone and headphone usage (for Standard AC’97 implementation) and also support new dynamic front panel jack detection and re-tasking usage models (for Intel®^ High Definition Audio).

2.3.2 Features

The front panel audio connector is designed to support stereo audio output (headphone or amplified speakers) and a microphone input. Designs using Intel®^ High Definition Audio (Intel®^ HD Audio) permit the two front panel jacks to be dynamically reconfigured as input or outputs, depending upon the desired application.

2.3.3 Audio Design Considerations

Front panel audio design in conjunction with motherboard audio header design is dependant upon the type of audio CODEC being used on the motherboard. In the past, AC’97 Integrated Audio CODECs were prevalent. With the introduction of Intel High Definition Audio, many new motherboard designs are switching over to High Definition (HD) audio CODECs. Designers should note that AC’97 and Intel High Definition Audio front panel motherboards and I/O cards implementations are different and may not be directly compatible or interchangeable

CAUTION

It is strongly recommended that motherboard designers only use Intel ®^ HD Audio analog front panel dongles with the Intel ®^ HD Audio analog front panel header to insure that the jack detection and dynamic re-tasking capability is preserved. Passive AC’97 analog front panel dongles (ones which leave the 5V Analog pin-7 line unconnected on the dongle) may be used with the Intel ®^ HD Audio analog front panel header. But note that the front panel jack detection and re-tasking functionality will be lost as the AC’97 jacks cannot support connection to the SENSE line. In addition, software must be aware that an AC’97 dongle is being used with an Intel ®^ HD Audio analog header since the software might need to dedicate codec ports that are connected to the header to meet the product’s intended functionality.

2.3.4 AC’97 Audio

2.3.4.1 AC’97 Audio Electrical Considerations

A standard AC’97 front panel audio dongle schematic is shown in Figure 2. The two front panel audio outputs (FP_OUT_L and FP_OUT_R) send and the two front panel audio returns (FP_RETURN_L and FP_RETURN_R) connect to a switching-type, 3.5 mm (1/8-inch) ring-tip- sleeve mini-phone jack mounted on the front panel. The signal path is such that the motherboard CODEC or output amplifier feeds the front panel jacks via FP_RETURN_L and FP_RETURN_R. When the front panel jack is not in use, these signals pass through the front panel jack shunt springs to the back panel jack via the signals FP_RETURN_L and FP_RETURN_R. When headphones are

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plugged into the front panel jack, these return signals which feed that back panel jack are disconnected, thus muting the back panel output.

Note that the motherboard should not leave the back panel signal floating when front panel devices are connected. Permitting the back panel signals to float could result in excessive noise at the back panel jack when the front panel jack is in use.

The motherboard designer should put weak pull-down resistors (10 k , for example) on the FP_RETURN_R and FP_RETURN_L lines. If using a single supply for the output amplifier, ensure that these resistors are located after the output capacitor to avoid loading down the amplifier bias. The grounded side of these pulldowns should be connected to analog ground to prevent digital noise from entering the audio sub-system.

MIC (^) AUD_GND

AC’97 Front Panel Dongle Schematic

JACK2 R JACK2 L

1 2

3 4

5 6

7

9 10

JACK1 L

MIC BIAS

FP_OUT_R

FP_OUT_L

FP_RETURN_R

FP_RETURN_L

AUD_5V

MIC Jack

Headphone Jack JACK1 L

Normally close shunt springs makecontact with the signal path and cannot be used for Jack detection.

2X5 Stake Pin Header (100mil Pitch)

**** Note:** ZL should be 600Ω or greater @ 100MHz with a low Q (broad Impedance curve over frequency)

EMI Filter ZL 220pF 220pF**

**ZL****

**ZL****

**ZL****

220pF 220pF

AUD_GND

Figure 2. AC’97 Front Panel Dongle Schematic