Microprocessors, also known as chips or CPUs (Central
Processing Units), are complex integrated circuits that
power computers and electronic devices. The process of
manufacturing chips involves several key steps,
including:
1. Design: Engineers create a detailed design of the
microprocessor using specialized software. This design
includes the arrangement and interconnection of
transistors, logic gates, and other components.
2. Photolithography: The design is translated into a physical
pattern known as a mask or reticle. This pattern is then
projected onto a silicon wafer using a technique called
photolithography. The wafer is coated with a light-
sensitive material called a photoresist, which is exposed
to ultraviolet light through the mask, defining the circuitry
pattern.
3. Etching: The exposed areas of the wafer's photoresist are
either dissolved or chemically altered, leaving behind the
desired circuit pattern. This process may involve chemical
etching or plasma etching to remove or modify the
exposed material.
4. Doping: To control the electrical properties of transistors,
various dopants (impurities) are introduced into specific
regions of the silicon wafer. This is achieved by
selectively implanting atoms or by diffusing dopant
materials into the wafer.
5. Deposition: Thin layers of insulating, conductive, or
semiconductive materials are deposited onto the wafer
surface using techniques such as chemical vapor
deposition (CVD) or physical vapor deposition (PVD).
These layers form the transistors, interconnects, and
other components of the microprocessor.
